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xFusion · Liquid cooling / rack-scale

xFusion FusionPoD DH120E V8 Node

Liquid-cooled / rack-scale platform; Hong Kong procurement enquiries

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1 official PDF

Manufacturer images

FusionPoD DH120E V8 Node manufacturer reference
xFusion manufacturer model/configuration reference; confirm ports, options, power and Hong Kong warranty at quotation.
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GET TO KNOW THIS PRODUCT

Product overview

xFusion FusionPoD DH120E V8 Node is a liquid-cooled rack node intended for integrated power and cooling infrastructure. CPU generation, memory and expansion interfaces vary by generation; confirm node, rack and management compatibility together.

At a glance

  • Processor2 x Intel® Xeon® 6 (Granite Rapids-AP) processors – Built-in memory controllers and 12 x memory channels per processor – Built-in PCIe controllers, supporting PCIe 5.0 and 96 x lanes … (see manufacturer options)
  • Memory– Up to 24 x DDR5 DIMMs – Up to 8800 MT/s – RDIMM and MRDIMM
  • Local Storage– Flexible drive configurations with up to 4 x front drives – Hot-swappable SAS/SATA U.2 drives – Multiple types of RAID controller cards supported

Published maxima do not imply every option can be configured together. Provide workload, capacity, connected equipment and installation environment so compatibility, accessories and delivery requirements can be checked against the full model and SKU.

Plan your configuration

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See all specifications

Technical specifications

Specifications from manufacturer information; confirm regional options against the quoted SKU.

Processor
2 x Intel® Xeon® 6 (Granite Rapids-AP) processors – Built-in memory controllers and 12 x memory channels per processor – Built-in PCIe controllers, supporting PCIe 5.0 and 96 x lanes … (see manufacturer options)
Memory
– Up to 24 x DDR5 DIMMs – Up to 8800 MT/s – RDIMM and MRDIMM
Local Storage
– Flexible drive configurations with up to 4 x front drives – Hot-swappable SAS/SATA U.2 drives – Multiple types of RAID controller cards supported
Network
Multiple network expansion capabilities; up to 2 x standard HHHL NIC slots which can be configured as required
Power module
3000 W DC module with rack power infrastructure
Chassis dimensions (H × W × D)
43.2 × 536 × 900 mm
Maximum weight
20.36 kg
Cooling options
CPU liquid cooling; optional memory liquid cooling

Additional information checked:

MANUFACTURER DOCUMENTS

Official PDFs & product information

1 PDF

Documents open on the manufacturer’s site in a new tab, in their original language. Family documents may include options not supplied in every configuration.

Sources & review dates

Specification source reviewed: 2026-10-23 · Product page published: 2026-10-23

Additional PDF links checked: 2026-10-26

Additional official PDF · www.xfusion.com

PLAN YOUR PURCHASE

Confirm the configuration before ordering

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